WinTech 2025:Green Future — Winbond × PSA


The annual technology flagship event WinTech 2025, co-hosted by Winbond and PSA, adopts a refreshed positioning this year under the core theme “Green Future,” focusing on how innovative technologies can enable a sustainable future.

WinTech will showcase how group members leverage a diverse portfolio of technologies and products—including MCU, memory ICs, MLCC, battery technologies, circuit protection components, high-frequency antennas, as well as mobile and automotive key modules—to deliver complete solutions spanning computing cores, data storage, power management, signal transmission, and human-machine interfaces. These solutions are widely applied across safety and security, automotive electronics, smart devices, industrial automation, and green energy sectors, continuously driving a future that is safer, more efficient, and more sustainable.

This forum brings together in-depth sharing from key technical experts across Winbond, Walsin Technology, Nuvoton, INPAQ, Silitech, and FDK Corporation. Discussions cover industrial applications, automotive systems, edge AI computing, cybersecurity, and power management. Through technology showcases and exploration of industry trends, the event aims to guide the industry toward a more efficient and sustainable technological future.

Event Details:

  • Date & Time: September 26, 2025 (Friday), 09:30–17:00 (Registration: 08:30–09:30)
  • Media Registration & Access: https://www.digitimes.com.tw/seminar/Winbond_20250926/
  • Organizer: Winbond and PSA Group
  • Venue: Hua Nan Bank International Convention Center, 123 Songren Road, Xinyi District, Taipei 110, Taiwan